美***Royec芯片拾取及放置系統 (Die Pick & Place Systems)NEW !! AP+ 全自動芯片分選系統
適用芯片尺寸: 托盤放置: 0.2 mm2 - >25 mm2
載帶放置: 0.5 mm2 - 17 mm2
輸入: 采用載帶框或蘭膜環，晶圓直徑至 Ø300 毫米
輸出: 載帶(寬度8 至 24 毫米，熱封或壓封)，Waffle packs 及Gel-Paks (2"- 4")，JEDEC盤，載帶框，蘭膜環或特別定制
放置精度: ± 12.5 微米(重復精度)
拾取原理: 表面或頂部邊緣真空拾取(采用：Rubber, Vespel,Tungsten carbide, elastomer) 可選非表面接觸的Vespel edge grip
產能: 根據不同產品，*短1.3 秒/循環
Die Pick & Place Systems (Royec)
NEW!!!!!AP+ automatic chip sorting system
Applicable chip size: tray placement: 0.2mm2-> 25mm2
Belt placement: 0.5 mm2 - maximum 17 mm2
Input: the loading box or LAN zona, wafer to Ø 300 mm in diameter
Output: bandages (8 to 24 mm wide, hot or pressed), Waffle packs ａnd gel-paks (2" -4 "), JEDEC disks, bandages, blue film rings or specially tailored
Placement accuracy: ± 12.5 microns (repeat accuracy)
Principle of picking: vacuum pick on surface or top edge (Rubber, Vespel,Tungsten carbide, elastomer) optional non-surface contact Vespel edge grip
Capacity: minimum 1.3 seconds per cycle for different products
滬公網安備31011502016460號
